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Global planarization technique/CMP by high precision polishing and its characteristics

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5 Author(s)
Karaki-Doy, T. ; Fac. of Educ., Saitama Univ., Urawa, Japan ; Haedo Jeong ; Nakagawa, T. ; Ohmori, Hitoshi
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In this research we built a prototype of planarization polishing or so-called Chemical and Mechanical Polishing (CMP) using high precision mechanical processing techniques, and thereafter, gained an understanding of basic processing characteristics using model device wafers. As a result, notedly better characteristics such as planarity and uniformity than those obtained to date have been achieved and thus we have gained guidelines so as to implement those characteristics as part of the semiconductor manufacturing equipment

Published in:

Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on

Date of Conference:

17-19 Sep 1995

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