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The use of MEMS is becoming more common in consumer products such as game consoles. But for high reliability domains such as space, there is still a long path. Consequently, the support for process and failure analysis of MEMS devices requires adapted analysis techniques to face growing complexity, reliability and manufacturability challenges. There are already several analysis techniques for micro-electronics components. The goal is to adapt these well known techniques to the failure analysis and characterization of MEMS. In this context a new MEMS failure analysis technique based on thermal laser stimulation has been adapted to characterize short circuit localization in a MEMS pressure sensor.