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An advanced reliability improvement and failure analysis approach to thermal stress issues in IC packages

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3 Author(s)
Michael Hertl ; Insidix, 24 rue du Drac, F-38180 Grenoble/Seyssins, France ; Diane Weidmann ; Alex Ngai

A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

Published in:

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Date of Conference:

6-10 July 2009