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Root cause identification of subtle filament shorts in microprocessors using nano-probing

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3 Author(s)
H. E. Lwin ; Advanced Micro Devices Singapore Pte Ltd, 508, Chai Chee Lane, Singapore 469032 ; V. Narang ; J. M. Chin

It has been a challenge for failure analysts to isolate non-visible defects due to the limitations of failure analysis (FA) tools and techniques. Sub-nano defects are often difficult to detect, particularly in highly complex integrated circuit devices. This paper emphasizes the growing importance of nano-probing and its capability to detect subtle defects like nano-sized stringer shorts, which previously went undetected. Successful case studies involving the use of nano-probing techniques to help isolate subtle defects (i.e., those that cause device failure) will be discussed.

Published in:

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Date of Conference:

6-10 July 2009