By Topic

Reliability of an Electronic Assembly: A Case History

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Hart, Louis ; Dept. D73, Bldg 061; IBM Communication Products Division; Research Triangle Park, North Carolina 27709 USA.

This article describes the work done in evaluating the reliability of a printed-circuit-card assembly. Some assemblies went through thermal shock, humidity, and power-temperature cycling. A model was developed for interpreting a long term, high temperature life-test. Two iterations of the life test took place as part of the evaluation. A short term, intermediate temperature life-test of a relatively large number of assemblies preceded release to manufacturing.

Published in:

Reliability, IEEE Transactions on  (Volume:R-36 ,  Issue: 4 )