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Thermal Design of Electronic-Circuit Layout For Reliability

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2 Author(s)
Hariom Gupta ; Department of Electrical Engineering; University of Roorkee; Roorkee, 247672 INDIA. ; Jaydev Sharma

A method for laying out electronic components on back board, which minimizes the maximum temperature rise of components is presented. This avoids hot spots on the board. Sensitivity analysis is adopted for optimal placement of components on the circuit board and certain relations are derived with a view to reduce the computational effort of sensitivity analysis.

Published in:

IEEE Transactions on Reliability  (Volume:R-31 ,  Issue: 1 )