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A high-performance microprocessor-compatible small size full CMOS SRAM cell technology has been developed. A 0.3-/spl mu/m gate length load pMOSFET, formed utilizing amorphous-Si-film through-channel implantation, is merged with a 0.25-/spl mu/m gate length pMOSFET for the peripheral circuits. Mask-free contact for TiN local interconnect is developed with wet etching. A 6.93-/spl mu/m/sup 2/ cell area and a high-performance 1.8-V circuit are thus realized.
Date of Conference: 6-8 June 1995