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The following topics are dealt with: polymer cure modelling; electronics packaging; polymer protection device; nanorods; nanotiles; printed circuit board; focused ion beam; magneto-caloric effect; supercapacitors; solder spread factor; conductive polymers; ohmic contact; polarized beam splitting devices; microfluidic systems; capacitive sensor; resonant-tunnelling diode; cell culture measurement device; laser soldering; ageing process; power electronic devices; solder joint mechanical strength; lead-free solder joints; heat pipes; power wire-wound resistors; pyroelectric infrared detectors; electro ultrasonic spectroscopy; failure analysis; electronic oscillators; class E power amplifier; bipolar junction effects; half-bridge inverter; mechatronic system; electro-pneumatic automotive systems; capacitive pressure sensor; system-on-chip devices; microstrip bandpass filters; vibrating wire transducers; MIM structures; web server based remote health monitoring system; surface roughness; blood-borne pathogens; carbon nanotubes; glutathione-coated quantum dots; defect thermal ionisation energies; virtual enterprise network; train spring system diagnostics; conjunctural adaptive system; and digital sinewave generator.

Published in:

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Date of Conference:

13-17 May 2009