Cart (Loading....) | Create Account
Close category search window
 

Silicone-based encapsulation of a cell culture measurement device under physiological conditions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wissenwasser, J. ; Nano-Syst., Austrian Res. Centers GmbH, Vienna, Austria ; Vellekoop, M. ; Nicolics, J.

Impedance measurement with interdigitated electrode structures (IDES) is suitable for monitoring concentration and proliferation of adherent biological cells [1]. In some applications [2] the sensor interface has to be operated in the humid environment where the cells are cultivated. There, the combination of the ambient humidity with ionic contaminations of the electronic components causes a drift in the sensor signals. We present an encapsulation based on polydimethylsiloxane (PDMS), a silicone, which reduces humidity-induced drift of the sensor signals to values clearly below 1%. Affection of the cell culture media or the cell culture by gas emission of the cured PDMS was not observed.

Published in:

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Date of Conference:

13-17 May 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.