By Topic

PCB via depth effect on SSN for FPGA

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Chin Pheing Wong ; Bayan Lepas Technoplex, Altera Corp., Bayan Lepas, Malaysia ; Pui Ling Lee ; Wei Wei Lo ; Man On Wong

This paper analyzes the effects of the PCB signal via depth on the simultaneous switching noise (SSN) in a field programmable gate array (FPGA) device. SSN consists of two distinct components: mutual inductive coupling noise and power distribution network (PDN) noise. This paper presents an experimental study of the PCB signal via depth effects on mutual inductive coupling noise using an Altera FPGA device. This paper also describes the return current path concept and the effect of the return current path on SSN in a multi-layer PCB. The results from this study assist electronic system designers in understanding the PCB signal via depth effects on SSN and identifying strategies for reducing and minimizing SSN.

Published in:

Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on

Date of Conference:

15-16 July 2009