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New Two-Dimensional Solid State Pixel Detectors With Dedicated Front-End Integrated Circuits for X-Ray and Gamma-Ray Imaging

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5 Author(s)
Tumer, T.O. ; NOVA R&D, Inc., Riverside, CA, USA ; Cajipe, V.B. ; Clajus, M. ; Hayakawa, S.
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New two-dimensional (2D) position sensitive solid state pixel detectors with dedicated multi-channel mixed-signal front-end readout integrated circuits (ICs) have been developed for x-ray and gamma ray imaging. These pixel detectors were designed to be versatile and accommodate many types of position-sensitive solid-state sensors. These 2D pixel detectors are designed to address the needs of a wide range of photon counting applications with high energy resolution imaging, high spatial resolution and for fast photon counting with simultaneous multiple energy binning capability. The first family of these pixel detectors is intended for spectroscopy applications with sensors such as Si, Ge, GaAs, HgI2, PbI2, Se, CdTe and CdZnTe in a variety of configurations to detect and image x-rays and gamma-rays of energies up to 1.3 MeV. The second family is developed for fast photon counting with simultaneous energy binning. They can be used with similar solid state sensors. The third family is for high spatial resolution imaging with resolution down to 50 times 50 micron.

Published in:

Nuclear Science, IEEE Transactions on  (Volume:56 ,  Issue: 4 )