Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Polymer Optical Fiber Sensors for Distributed Strain Measurement and Application in Structural Health Monitoring

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Liehr, S. ; BAM Fed. Inst. for Mater. Res. & Testing, Berlin, Germany ; Lenke, P. ; Wendt, M. ; Krebber, K.
more authors

Polymer optical fiber (POF) sensors have the unique ability to measure high strain distributed along the fiber up to 40% using the optical time-domain reflectometry (OTDR) technique. Both, standard PMMA fibers and perfluorinated (PF) graded-index (GI) POF are introduced and evaluated in potential use and applicability. Further, distributed length change measurement based on cross-correlation analysis of the characteristic fiber signature of PF POF is introduced. We conclude the advances in distributed POF strain sensors technology with respect to application in structural health monitoring. Special focus is on the sensor integration into technical textiles for health monitoring of geotechnical structures and masonry structures. Measurement results of sensor-equipped textiles in different model tests are presented, displacement of soil and cracks in retrofitted masonry structures are detected and evaluated.

Published in:

Sensors Journal, IEEE  (Volume:9 ,  Issue: 11 )