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Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance

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2 Author(s)
Savidis, I. ; Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA ; Friedman, E.G.

Closed-form expressions of the resistance, capacitance, and inductance for interplane 3-D vias are presented in this paper. The closed-form expressions account for the 3-D via length, diameter, dielectric thickness, and spacing to ground. A 3-D numerical simulation is used to extract electromagnetic solutions of the resistance, capacitance, and inductance for comparison with the closed-form expressions, revealing good agreement between simulation and the physical models. The maximum error for the resistance, capacitance, and inductance is less than 8%.

Published in:

Electron Devices, IEEE Transactions on  (Volume:56 ,  Issue: 9 )

Date of Publication:

Sept. 2009

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