By Topic

Secure Mobile Payment System in Wireless Environment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Manvi, S.S. ; Dept. of Inf. Sci. & Eng., REVA Inst. of Technol. & Manage., Bangalore, India ; Bhajantri, L.B. ; Vijayakumar, M.A.

Mobile payments are payments that are carried out through mobile devices in wireless environment. Mobile payment is considered as the accelerator of e-commerce and m-commerce. Currently mobile payments deal with several problems to improve requirements of m-commerce such as: simplifying the mobile payment processes for consumers, improving the security of payment, especially the application of digital signing in mobile payment. The proposed work introduces alternative ways for providing mobile banking services aimed at J2ME enabled mobile phones over Bluetooth communication. The scope of the proposed solution is the combination of J2EE and J2ME capabilities, means of overcoming the API and technical limitations, as well as security consideration. This paper defines the secure mobile payment system to allow mobile users to conduct mobile transactions over Bluetooth communications but also supports the related secured transactions between the payment server and mobile clients. Finally, we have discussed some of the performance parameters such as: time required to password hack for various character lengths, delay and probability error rate.

Published in:

Future Computer and Communication, 2009. ICFCC 2009. International Conference on

Date of Conference:

3-5 April 2009