Referenced Items are not available for this document.
Flip chip bonding technique using Pb/In solder bumps was applied to packaging a 10 Gbps laser diode (LD) submodule for high-speed optical communication systems. Dependence of parasitic parameters on the small signal modulation bandwidth of the LD submodule was investigated through SPICE simulations. Experimentally, a small signal modulation bandwidth of 14 GHz at 100 mA dc bias current and the clean modulation response up to 20 GHz were obtained in the flip-chip bonded LD submodule, which was wider than that of the wire-bonded 10 Gbps LD submodule by a difference of 3.8 GHz
Published in:
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Date of Conference: 21-24 May 1995
- Page(s):
- 872 - 875
- Meeting Date :
- 21 May 1995-24 May 1995
- Print ISBN:
- 0-7803-2736-5
- INSPEC Accession Number:
- 5170221
- Conference Location :
- Las Vegas, NV
- Digital Object Identifier :
- 10.1109/ECTC.1995.517790
- Product Type:
- Conference Publications
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