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Improved yield and performance of ball-grid array packages: design and processing guidelines for uniform and non-uniform arrays

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5 Author(s)
Heinrich, S.M. ; Dept. of Civil & Environ. Eng., Marquette Univ., Milwaukee, WI, USA ; Shakya, S. ; Wang, Y. ; Lee, P.S.
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Two models are presented for analyzing BGA solder interconnects: (a) a model for predicting solder joint geometries after an upright or inverted reflow process, and (b) a reliability model for estimating maximum shear strain and fatigue life under a global thermal mismatch load condition. The reliability model includes a newly derived closed-form expression relating the maximum shear strain in a solder joint to the load, material, and joint shape parameters. The models are used to generate design/processing guidelines that may be used to improve the yield of a BGA soldering operation and the in-service reliability of the interconnect. Potential benefits of using a non-uniform array (i.e., one including joints of different size and shape) are explored

Published in:

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Date of Conference:

21-24 May 1995