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Laser diode array packaging for coupling to optical polyimide waveguides in optoelectronic multichip modules

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3 Author(s)
Koike, S. ; NTT Interdisciplinary Res. Labs., Japan ; Matsui, S. ; Takahara, H.

Opto-electronic multichip modules (OE-MCMs) using organic optical waveguides formed on copper-polyimide multilayer substrates are a promising packaging technology for future photonic switching systems. A laser diode (LD) array packaging technique for coupling to polyimide waveguides on the OE-substrate was developed, in which junction-up, 5-channel InGaAsP edge-emitting LD array (λ=1.3 μm) was positioned on the terrace with passive alignment in the vertical direction, then butt-coupled to the waveguides on the OE-substrate. Optical interconnections between the 5-ch LD array and the waveguides were achieved with the coupling loss of 6.5 dB and deviation between channels of ±0.5 dB

Published in:

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Date of Conference:

21-24 May 1995

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