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A design for planar electromagnetic absorbers is presented. The performance of this absorber is maintained over a wide incidence angles and for both TE and TM polarization. The absorber is composed of a high-impedance surface comprising an array of patches over a grounded lossy dielectric slab perforated with metallic vias (wire medium). The main contribution of the paper is to demonstrate and practically use the presence of an additional resonance when the plasma frequency of the wire medium in the dielectric substrate is close to the original resonance of the high-impedance surface. The presence of the vias between FSS and the ground plane is discussed both for the case of a high-permittivity absorber and for a low permittivity one, through the derivation of simple and efficient analytical expressions, specifically derived for the problem at hand. We show that the presence of the vias influences the oblique incidence TM absorption, and when properly designed, the insertion of the vias into the absorber structure results in a bandwidth enlargement and higher absorption performance.