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Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620TM microprocessor

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1 Author(s)
Kroman, G. ; Adv. Packaging Technol., Motorola Inc., Austin, TX

This paper presents various thermal management options for a high-performance RISC microprocessor available for controlled-collapse-chip-connection (C4) die attached to a ceramic-ball-grid-array substrate (CBGA), as they apply to air-cooled systems. Computational-fluid dynamics (CFD) methods are used to solve the conjugate heat transfer problems and a thermal test vehicle mounted to a printed-circuit board was used to validate the models. The internal package's contribution is typically less than 18% of the overall junction-to-ambient temperature rise. Of this 18%, approximately 85% is associated with the thermal paste internally sealed; while, the lid and the silicon chip account for the other 15% (approximately equal). For moderate airflow applications in the 1 to 4 m/s, the PowerPC 620 microprocessor will require a relatively large heat sink, approximately 20 times that of the C4/CBGA package, to maintain its die-junction temperature. The proper selection of a thermal interface material is critical in minimizing the thermal contact resistance between the package and the heat sink. Considering, the low interface pressure, the synthetic grease offers the best performance

Published in:

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Date of Conference:

28-31 May 1996

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