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Analytical Solutions for PCB Assembly Subjected to Mismatched Thermal Expansion

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3 Author(s)
E. H. Wong ; Singapore Inst. of Manuf. Technol., Singapore, Singapore ; Kian-Meng Lim ; Yiu-Wing Mai

Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis.

Published in:

IEEE Transactions on Advanced Packaging  (Volume:32 ,  Issue: 3 )