By Topic

Process Parameters Optimization: A Design Study for TiO _{2} Thin Film of Vacuum Sputtering Process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wen-Hsien Ho ; Dept. of Med. Inf. Manage., Kaohsiung Med. Univ., Kaohsiung, Taiwan ; Jinn-Tsong Tsai ; Gong-Ming Hsu ; Jyh-Horng Chou

This paper proposes a procedure for process parameters design by combining both modeling and optimization methods. The proposed procedure integrates the Taguchi method, the artificial neural network (ANN), and the genetic algorithm (GA). First, the Taguchi method is applied to minimize experimental numbers and to collect experimental data representing the quality performances of a system. Next, the ANN is used to build a system model based on the data from the Taguchi experimental method. Then, the GA is employed to search for the optimal process parameters. A process parameters design for a titanium dioxide (TiO2) thin film in the vacuum sputtering process is studied in this paper. The quality objective is to form a smaller water contact angle on the TiO2 thin-film surface. The water contact angle is 4?? obtained from the system model of the proposed procedure. The process parameters obtained from the proposed procedure were used to conduct the experiment in the vacuum sputtering process for the TiO2 thin film. The water contact angle given from the practical experiment is 3.93??. The difference percent is 1.75% between 4?? and 3.93??. The result obtained from the system model of the proposed procedure is promising. Hence, we can conclude that the proposed procedure is a very good approach in solving the problem of the process parameters design.

Published in:

Automation Science and Engineering, IEEE Transactions on  (Volume:7 ,  Issue: 1 )