Cart (Loading....) | Create Account
Close category search window
 

The approximate modal interface—solution space projection method including internal ports for efficient finite-element analysis of multilayer printed circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Shih-Hao Lee ; Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA ; Jian-Ming Jin

In the simulation of multilayer circuit boards or packages, it is often of interest to know the interaction between different nodes inside the structure, and as a result internal ports have to be employed. In this paper the approximate modal interface (AMI) formulation is presented, including internal ports, which are in the form of a lumped current source assigned along element edges. The resulting numerical scheme can also handle various kinds of frequency-dependent components and numerical boundaries in each subdomain and on subdomain interfaces.

Published in:

Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE

Date of Conference:

1-5 June 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.