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Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling and during normal usage. Measurement of transient dynamic deformation of the electronics assemblies during the shock and vibration can yield significant insights in understanding the occurrence of failure modes and the development of failure envelopes. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. Previous researchers have measured the transient-dynamics of board assemblies with high-speed imaging in conjunction with high-speed image analysis for measurement of relative displacement, angle, velocity, and acceleration. In addition, high-speed data-acquisition systems with discrete strain gages have been used for measurements of transient strain and with accelerometers for measurement of transient acceleration. Development of accurate models requires better understanding of full-field strain deformation in board assemblies. In this paper, the use of digital image correlation (DIC) with ultra high-speed imaging has been used for full-field measurement of transient strain in various board assemblies subjected to shock in various orientations. Measurements have been taken on both the package and the board side of the assemblies. Accuracy of high-speed optical measurement has been compared with that from discrete strain gages. Package architectures examined include-flex ball-grid arrays, tape-array ball-grid arrays, and metal lead-frame packages. Explicit finite-element models have been developed and correlated with experimental data. Models developed include, smeared property models, Timoshenko-beam models, and explicit sub-models. The solder strains have been computed from the explicit finite element models for life prediction in shock.
Components and Packaging Technologies, IEEE Transactions on (Volume:32 , Issue: 2 )
Date of Publication: June 2009