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Solder joint reliability issues that can be identified only at the system level are notoriously difficult to resolve in a timely manner using trial and error experimentation alone. The particular case of solder joint reliability of a side switch in a phone subjected to drop-impact is addressed. An approach employing Response Surface Methodology (RSM) is proposed to solve reliability and robust design problems in advanced packaging. A 10x improvement in the drop test failure rate is demonstrated with a minimum of trial and error experimentation. Technical contributions are a) a novel drop life response function derived from strain energy principles, and b) an approach to address package reliability issues at the system level.
Components and Packaging Technologies, IEEE Transactions on (Volume:32 , Issue: 2 )
Date of Publication: June 2009