By Topic

Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wang, Jianli ; Department of Engineering Mechanics, Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Tsinghua University, Beijing 100084, People''s Republic of China ; Ming Gu ; Zhang, Xing ; Wu, Gangping

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.3159863 

The thermal effusivity of a fine wire and the thermal contact resistance of a junction have been measured by a modified T type probe using a periodic heating method. The modified T type probe is made of a short periodic heated platinum wire and a test wire with one end contacting to the midpoint of the hot wire. Dimensionless expressions for the temperature responses of the hot wire with respect to the thermal effusivity of the test wire and the thermal contact resistance of the junction between the test wire and the hot wire were presented. A measurement system based on a flexible resolution A/D board and a LABVIEW-based virtual lock-in was setup. The probe was further verified by measuring four kinds of commercially available metallic wires at room temperature. The obtained thermal contact resistances were repeatable, with the calculated thicknesses of about 1 to 2 μm. The present method can further be applied to measure the thermal effusivity of nonconductive wires, and to analyze the thermal contact resistance of nano/microscale junction.

Published in:

Review of Scientific Instruments  (Volume:80 ,  Issue: 7 )