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DBC Technology for Extremely Thin Flat Heat Pipes

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6 Author(s)
Kamenova, L. ; Grenoble Electr. Eng. Lab., Grenoble Univ., St. Martin d''Heres, France ; Avenas, Y. ; Schaeffer, C. ; Tzanova, S.
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This paper presents the concept and experimental demonstration of flat copper heat pipe (HP) embedded in extremely thin 3-D packaging substrates. Since conventional machining for this application is very complicated and expensive, the direct bonded copper (DBC) technology proved to be interesting for mass production. The experimental results demonstrated that the DBC HP is an excellent solution to enhance the heat transfer within the 3-D packaging.

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Industry Applications, IEEE Transactions on  (Volume:45 ,  Issue: 5 )