By Topic

Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Pilgrim, J.A. ; Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK ; Swaffield, D.J. ; Lewin, P.L. ; Larsen, S.T.
more authors

Recent computational advances have increased the viability of using numerical modelling techniques such as finite element analysis (FEA) to compute the rating of cable circuits. Such analysis has previously been completed for directly buried and force cooled cable circuits, but without direct consideration of the joint bay. In previously presented work a 2D axially symmetric finite element model of a 400 kV straight joint was created, allowing for a sensitivity analysis of the model parameters to be performed. Modelling has been subsequently expanded into 3D to allow the calculation of the temperature profile within a 3 phase circuit force cooled cable joint bay. This paper presents a discussion of results obtained from a model of the force cooled cable joint bay and the implications on the circuit rating.

Published in:

Electrical Insulation Conference, 2009. EIC 2009. IEEE

Date of Conference:

May 31 2009-June 3 2009