Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Miniaturized hybrid ring circuits using T-type folded substrate integrated waveguide (TFSIW)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yan Ding ; Dept. of Elec. Eng., Ecole Polytech. (Univ. of Montreal), Montreal, QC, Canada ; Ke Wu

T-type folded substrate integrated waveguide (TFSIW) scheme is an effective SIW miniaturization technique for developing high-density integrated circuits. In this paper, the propagation constant and characteristic impedance of TFSIW structures are analyzed on the basis of their equivalent circuits. To demonstrate the circuit applications, the design procedure of a proposed TFSIW hybrid ring is presented and discussed with reference to the calculated parameters. Simulation results of the designed coupler ring circuit are compared with measurement results.

Published in:

Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International

Date of Conference:

7-12 June 2009