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Thermal-Laser-Separation (TLS) - Dicing is a fast, clean and cost effective alternative for common dicing technologies. The process uses thermal induced mechanical forces to separate brittle materials like Silicon, GaAs or others. Heating is done very well defined by the spot of a laser. For cooling is a water-spray used. The induced forces separate brittle materials by cleaving. Even though TLS is a two-step process, especially for thin wafers a significant higher throughput is possible compared to mechanical sawing and known laser technologies. The yield is increased due to reduced breakage as well as by a reduced street width. TLS-dicing permit a minimal cost of ownership. In this paper after a description of basic principle and properties of the process a comparison with other dicing technologies is done. The advantages and disadvantages of TLS-dicing will be discussed. The prototype system will be described as well as applications of special interest.