By Topic

Electroluminescence thermal quenching in alternating-current thin-film electroluminescent devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Baukol, B.A. ; Department of Electrical and Computer Engineering, Center for Advanced Materials Research, Oregon State University, Corvallis, Oregon 97331-3211 ; Hitt, J.C. ; Wager, J.F. ; Sun, S.-S.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

Electroluminescence (EL) thermal quenching in alternating-current thin-film electroluminescent (ACTFEL) devices refers to a reduction in the luminance with increasing temperature, which is in excess to that of normal thermal quenching and is concomitant with a reduction in the transferred charge. A comparison of thermal quenching trends for ZnS:Mn, SrS:Ce, SrS:Cu,Ag, and multilayer SrS:Cu,Ag/SrS:Ce ACTFEL devices is presented. Respectively, ZnS:Mn; SrS:Cu and SrS:Cu,Ag; and SrS:Ce and multilayer SrS:Cu,Ag/SrS:Ce ACTFEL devices exhibit very little (normal), a large amount (of primarily EL), or a small amount (of primarily normal) thermal quenching. Insertion of one or more interface layers of SrS:Ce significantly reduces the extent of EL thermal quenching in a SrS:Cu,Ag ACTFEL device. Simulation suggests that SrS:Ce interface layers decrease the rate and displace the location of hole creation by band-to-band impact ionization away from the SrS:Cu,Ag layer, where hole trapping at Cu or Ag acceptor sites leads to EL thermal quenching via thermally activated annihilation of positive space charge due to thermionic emission of holes from Cu or Ag acceptor traps. © 2001 American Institute of Physics.

Published in:

Journal of Applied Physics  (Volume:90 ,  Issue: 5 )