By Topic

Improvement of Reversible Strain Limit for Critical Current of DI-BSCCO Due to Lamination Technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Osamura, K. ; Res. Inst. for Appl. Sci., Kyoto, Japan ; Machiya, S. ; Suzuki, H. ; Ochiai, S.
more authors

The DI (dynamically innovative)-BSCCO-Bi2223 tapes achieved high critical current as well as high modulus of elasticity. Further the reversible strain limit and the corresponding stress for critical current have been remarkably increased by means of lamination technique. During the course of development, their optimized architecture has been designed based on the principle of the rule of mixture for maximizing the force free strain exerted on the superconducting component. The reversible strain/stress limit (A rev/R rev) was defined as a strain, at which the critical current recovers to the level of 99% I co. Selecting several kinds of laminating materials and changing condition of the fabrication, the excellent Cu alloy-3ply tape with I co of 311 A/cm was realized of which A rev and R rev reached 0.42% and 300 MPa, respectively. Further during the theoretical analysis, the increase of reversible strain limit were made clear to be attributed to the increase of thermally induced residual strain as well as the compensation effect of laminated layers against a local fracture mode.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:19 ,  Issue: 3 )