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Thermal management of VCSEL-based optoelectronic modules

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6 Author(s)
Lee, Y.C. ; Center for Optoelectron. Comput. Syst., Colorado Univ., Boulder, CO, USA ; Swirhun, S.E. ; Fu, W.S. ; Keyser, T.A.
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The development of reliable optoelectronic modules based on vertical-cavity surface-emitting lasers (VCSELs) will depend strongly on proper thermal management. One of the module's critical thermal paths is from a VCSEL to a heat sink, which is affected by packaging technologies and materials. The measured VCSEL-to-case resistance of a laser with 8-μm aperture was 1650°C/Watt, and that of a 20-μm device was 1070°C/Watt. To study the packaging effects, a 3-D numerical model has been developed and calibrated by the measured data. The calibrated model was used to understand the difference in thermal behavior (1) between a wire-bonded and a flip-chip VCSEL module, (2) between a single-VCSEL and an 8×8-VCSEL module, and (3) between a bottom-cooled and an top-cooled module

Published in:

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Date of Conference:

21-24 May 1995