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New latchup failure mechanism induced by an elevated via resistance on multilayer CMOS technology

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3 Author(s)
Chen, Y.-C.S. ; Intel Corp., Chandler, AZ, USA ; Sam Hu ; DeBonis, T.J.

A parasitic PNP initiated Vcc latchup failure mechanism was identified as the cause of a blown via contact failure mode. Highly resistive via contacts connecting the underlying N-well substrate to its upper layer Vcc metal bus lines were consistently observed at failing circuits. A defective tungsten (W) plug was determined to be the root cause of the failure mechanism. Based on an established failure model, a circuit simulation was conducted to investigate the impact of via series resistance on latchup triggering current. The contribution of via contact resistance in triggering a latchup mechanism must be considered to maintain high reliability microprocessor products.

Published in:

Reliability Physics Symposium, 1995. 33rd Annual Proceedings., IEEE International

Date of Conference:

4-6 April 1995

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