By Topic

Modeling and fabrication of thin film thermopile sensor

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
5 Author(s)
Kim, Jung-Kyun ; Gwangju Institute of Science and Technology (GIST), 1 Oryoung-dong, Buk-gu, Gwangju 500-712, Republic of Korea ; Kim, Tae-Hwa ; Cho, Sung-Cheon ; Shin, Sang-Mo
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.3046152 

A thin film micro heat-flux sensor using thermopile, which can measure the heat flow, was fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a ten-junction polysilicon and aluminum thermoelectric sensor with an ultralow noise preamplifier and low pass Butterworth filter has enabled the resolution of 3.4 μW power and shows the sensitivity of 2.43 mVW. In order to estimate the heat generation of samples from the output measurement of a micro heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in a micro heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph methodology. The electro-thermal system model, where the thermal domain and the electrical domain are coupled, expresses the behavior that the heat generation of samples converts thermal input to electrical output through the system model. The proposed electro-thermal system model shows good agreement with measured voltage responses.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:27 ,  Issue: 3 )