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Au–Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure

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4 Author(s)
Higurashi, E. ; Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan ; Chino, D. ; Suga, T. ; Sawada, R.

Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using Au-Au surface-activated bonding (SAB) at a relatively low bonding temperature of 150degC. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au SAB. By applying this technique, compact and thin optical microsensors (2.8 mm times 2.8 mm times 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.

Published in:

Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:15 ,  Issue: 5 )

Date of Publication:

Sept.-oct. 2009

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