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Finite element simulations are used to calculate the rate of whisker growth due to intermetallic formation in a Sn film with columnar grain structure on a Cu substrate. The simulations account for plastic flow by dislocation motion within the grains, as well as diffusion along grain boundaries. Grains with a slightly lower yield stress than their neighbors are shown to act as sinks for material and are progressively extruded from the film. A simple analytical model is developed to estimate the resulting whisker growth rate, and is shown to be in good agreement with experimental measurements.
Published in:
Applied Physics Letters
(Volume:94
,
Issue:
19
)
Date of Publication: May 2009
- Page(s):
- 191904 - 191904-3
- ISSN :
- 0003-6951
- Digital Object Identifier :
- 10.1063/1.3136865
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 24 June 2009
- Issue Date :
- May 2009
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