Cart (Loading....) | Create Account
Close category search window
 

Uniformity of Electrical Current Flow in Cylindrical Semiconductor Specimens with Cylindrical Metallic End Caps

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Simon, R. ; Battelle Memorial Institute, Columbus, Ohio ; Cahn, J.H. ; Bell, J.C.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1735959 

The distribution of current is computed in a cylindrical semiconductor specimen provided with cylindrical metallic end caps of the same diameter as that of the specimen and electrical lead wires of much smaller diameter. Nonuniformity of the longitudinal current density of 1% or less can be obtained in specimens with electrical resistivities at least 200 times greater than that of the end caps if the lengths of the specimens are at least equal to their diameters and if the length of each end cap is at least 0.3 diam.

Published in:

Journal of Applied Physics  (Volume:32 ,  Issue: 1 )

Date of Publication:

Jan 1961

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.