Skip to Main Content
A hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Applying the modal decomposition of the waves propagating inside the power-ground (P-G) planes and the signal traces, the electromagnetic fields can be decomposed into the parallel-plate mode and the transmission-line mode. The former is analyzed by using the SMM for the finite P-G planes with multiple vias. The multiconductor transmission-line theory is applied to model the micro-stripline and stripline in the package. Numerical simulations are illustrated for coupling analysis of P-G vias to the signal traces in the package and examined through experimental and numerical validations.