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Fast thermal analysis for CMOS VLSIC reliability

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2 Author(s)
Yi-Kan Cheng ; Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA ; Sung-Mo Steve Kang

In this paper, we present a fast thermal reliability diagnosis tool (iTHREAD) for CMOS VLSI chips. Unlike existing circuit-level electrothermal simulators, it finds the steady-state temperature distribution, the hot spots, as well as the resulting power consumptions in an extremely efficient way. By using a fast timing simulator with accurate temperature-dependent device models and a novel 3-D analytical thermal simulator, it can easily handle very large circuits. With iTHREAD, temperature-dependent reliability and timing problems of VLSICs can be accurately and quickly predicted. It can be further applied to guide the module placement, timing verification, and many other IC reliability diagnoses

Published in:

Custom Integrated Circuits Conference, 1996., Proceedings of the IEEE 1996

Date of Conference:

5-8 May 1996