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A low cost MCM-D technology applied to microwave integrated circuits

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8 Author(s)
C. A. Finardi ; Res. & Dev. Centre, Telecomunicacoes Brasileiras SA, Campinas, Brazil ; V. P. Neto ; R. A. Fischer ; A. Flacker
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The paper presents a new technological solution for fabricating microwave integrated circuits (MICs). This innovative approach is based on a deposited-multichip modules (MCM-D) technology developed at the R&D Centre of TELEBRAS. A description of the processing is presented and some results of MICs fabricated on alumina 96% are shown. The main features of this packaging technology are its low cost (<US$1.5/in 2), process simplification, reproducibility and microwave devices assembly compatibility. The paper demonstrates an easy solution for MICs fabrication that can be implemented with low investments

Published in:

Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International  (Volume:1 )

Date of Conference:

24-27 Jul 1995