Cart (Loading....) | Create Account
Close category search window

BiCS Flash as a Future 3D Non-Volatile Memory Technology for Ultra High Density Storage Devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Aochi, H. ; Center for Semicond. Res. & Dev., Toshiba Corp., Yokohama

In this presentation, recent reports on three dimensional non-volatile memories are reviewed and their pros and cons are discussed. BiCS (Bit Cost Scalable) flash technology is focused as one of the most promising candidates for the future ultra high density storage devices.

Published in:

Memory Workshop, 2009. IMW '09. IEEE International

Date of Conference:

10-14 May 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.