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Measurement of the intrinsic bond strength of brittle thin films on flexible substrates

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4 Author(s)
Guo, Q. ; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 ; Osaki, H. ; Keer, L.M. ; Wheeler, D.R.

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The brittle cracking and subsequent debonding of nickel films deposited on polymer substrates subjected to uniaxial strain is investigated. Stress analyses for a film/substrate system are performed. Based on the analysis, the interfacial bond strength between brittle thin films and flexible substrates can be evaluated in terms of the tensile strength of the coating and the length of the largest segment that first debonds. Experiments were performed on Ni films with different thicknesses evaporated on polyethylene terephthalate substrates and the intrinsic bond strength was evaluated. The interfacial bond strengths were shown to be relatively independent of the film thickness for the range studied.

Published in:

Journal of Applied Physics  (Volume:68 ,  Issue: 4 )