Close category search window
 

The role of point defects in anomalous diffusion of implanted boron in silicon

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Bao, Xi‐mao ; Department of Physics and Laboratory of Solid State Microstructures, Nanjing University, Nanjing, China ; Guo, Qiang ; Hu, Mei‐sheng ; Feng, Duan

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.344401 

The influence of implantation damage on the anomalous diffusion has been observed by varying the relative positions of the boron profile and damage distribution produced by silicon preimplantation at different energies. It is shown that the anomalous diffusion of implanted boron is caused by the implantation damage rather than the fast diffusing interstitial boron. During annealing, the extended defects acting as sinks for point defects retard the anomalous diffusion in and near the defected band, however, for prolonged annealing they begin dissolving and emitting point defects which support the anomalous diffusion.

Published in:
Journal of Applied Physics  (Volume:66 ,  Issue: 3 )

Date of Publication: Aug 1989

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.