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New module structure using flip-chip technology for high-speed optical communication ICs

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4 Author(s)
Yamaguchi, S. ; NTT LSI Labs., Kanagawa, Japan ; Imai, Y. ; Kimura, S. ; Tsunetsugu, H.

This paper describes a new module structure for 40-Gbit/s class ICs. This structure can eliminate cavity resonance in the package and excitation of parasitic propagation modes in RF feedthroughs. Additionally, the design makes use of flip-chip technology to minimize the parasitic reactance that can occur at interconnections between chips and substrates. These features make module operation stable at frequencies beyond 40 GHz. We also demonstrate a DC-to-40-GHz distributed amplifier IC module that uses this new technology.

Published in:

Microwave Symposium Digest, 1996., IEEE MTT-S International  (Volume:1 )

Date of Conference:

17-21 June 1996