Hydrogen was found to alter the electrical properties of gold (Au), titanium (Ti), and tungsten (W) thin films deposited on SiO2/Si substrates. Specifically, the addition of H2 was found to reduce both hillock growth and the rate of electromigration in Au and Ti films. The resistance and 1/f noise of unpassivated Au, Ti, and W films was also found to decrease in H2. The influence of H2 adsorption, absorption, compound formation, and film crystal structure [Au (fcc), Ti (hcp), and W (bcc)] on the rate of electromigration is explored. The data suggest that a modification of the stress state at the metal film/substrate interface is responsible for the decreased resistance, 1/f noise, and electromigration rates observed in H2.