Referenced Items are not available for this document.
This paper presents measurement, modeling and simulation studies of high-speed signal propagation in multi-layered PCB with turning vias (immediate layer changing) in a mixed-referencing environment. The effects of turning vias, plane referencing, decoupling capacitor placement and, panel dimensions on high-speed signal propagation in an organic board are studied.
Published in:
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Date of Conference: 26-29 May 2009
- Page(s):
- 1185 - 1192
- ISSN :
- 0569-5503
- E-ISBN :
- 978-1-4244-4476-2
- Print ISBN:
- 978-1-4244-4475-5
- INSPEC Accession Number:
- 10703027
- Conference Location :
- San Diego, CA
- Digital Object Identifier :
- 10.1109/ECTC.2009.5074162
- Product Type:
- Conference Publications
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