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3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

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10 Author(s)
Khan, N. ; Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore ; Hong Yu ; Tan Siow Pin ; Soon Wee Ho
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In this paper a liquid cooling solution has been reported for 3-D package in PoP format. The high heat dissipating chip is mounted on a silicon carrier, which has copper through-silicon via for electrical interconnection and through-silicon hollow via for fluidic circulation. Heat enhancement structures have been embedded in the chip carrier. Cooling liquid, de-ionized water is circulated through the chip carrier and heat from the chip is extracted. The fluidic channels are isolated from electrical traces using hermetic sealing. The research work has demonstrated 100 W of heat dissipation from one stack and total of 200 W from two stacks of the package. The fluidic interconnections and sealing techniques have been discussed.

Published in:

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Date of Conference:

26-29 May 2009