By Topic

Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Dongji Xie ; Flextronics Int. USA, San Jose, CA ; Gektin, V. ; Geiger, D.

This paper described a ceramic ball grid array (CBGA) and its second level reliability. The CBGA uses a substrate with high coefficient of thermal expansion (CTE) and leadfree soldering. The reworkability of the BGA package and board was also studied. The results have shown that this package is reworkable without a significant reliability reduction in the board level reliability. The reliability of solder joints in different chains is monitored and reported separately during the thermal cycling test to understand the impact of the distance to the neutral point. A finite element model of the test setup was created and modeling results were compared with the thermal cycling reliability test data. Acceleration factor has calculated for irregular temperature profiles as compared to the standard ATC profile. The impact of the highest temperature during the temperature cycle as well as the temperature range was shown to follow traditional Norris-Landzberg's equation. A recommendation is made to use the acceleration factor for translating the test data between different temperature cycling scenarios.

Published in:

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Date of Conference:

26-29 May 2009