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Thermal management for high-power active amplifier arrays

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2 Author(s)
Kolias, N.J. ; Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA ; Compton, R.C.

Much of the active array work reported to date has been directed toward the demonstration of prototypes at low-power levels. Analysis results presented here show that overheating failures will occur as these arrays are scaled to reasonable output powers. Large air-cooled heat sinks attached to the backside of a thinned array can be used for single-sided designs such as oscillator arrays, but heat sinking becomes substantially more difficult for two-sided transmission-type arrays. For these designs, a possible solution is described which uses an aluminum-nitride dielectric layer to facilitate conduction to heat sinks on the array's perimeter

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:44 ,  Issue: 6 )

Date of Publication:

Jun 1996

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