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Forced convective air cooling from electronic component arrays in a parallel plate channel

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5 Author(s)
Gan, Y.P. ; Dept. of Thermal Energy Eng., Beijing Polytech. Univ., China ; Deng, Q.J. ; Ma, F. ; Yuan, X.Y.
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This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas was obtained to correlate the experimental data for air cooling systems design. Arrays of components with one odd-sized module have also been tested. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared to uniform arrangements. Accordingly, temperature sensitive components are suggested to be placed in these locations

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:19 ,  Issue: 2 )