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Forced convective air cooling from electronic component arrays in a parallel plate channel

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5 Author(s)
Y. P. Gan ; Dept. of Thermal Energy Eng., Beijing Polytech. Univ., China ; Q. J. Deng ; F. Ma ; X. Y. Yuan
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This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas was obtained to correlate the experimental data for air cooling systems design. Arrays of components with one odd-sized module have also been tested. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared to uniform arrangements. Accordingly, temperature sensitive components are suggested to be placed in these locations

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:19 ,  Issue: 2 )